Infrastructure & Machinery

Solder Paste Printer

  • Fuji - GPX-CII Automated Solder Paste/Glue Printer.
  • Applicable panel size 48 x 48mm to 610 x 610mm.
  • Alignment Accuracy: ± 0.010mm, 6σ [CpK≥2.0]
  • WetPrinter Accuracy: ± 0.018mm, 6σ [CpK≥2.0]
  • Printer Cycle time: 6.0 seconds (including panel loading, unloading, mark reading, mask alignment)
  • Auto Paste Dispenser JAR type with Solder Roll Dia Check function.
  • Stencil Cleaning: Dry + Wet + Vacuum.
  • SPI Closed loop function.
  • Local Verifier - with Handy Barcode Scanner.
  • Automatic width adjustment.

3D Solder Paste Inspection

  • Koh Young inline 3D SPI– KY8080-L.
  • Printer close Loop Feedback.
  • Camera Barcode reader.
  • PCB Warp Compensation: Z Tracking.
  • Detects Insufficient Paste, Excessive Paste, Missing‐Paste, Bridging, Shape Deformity, Paste Displacement, Volume, Height, XY Position, Area.
  • Koh Young proprietary light projection unit for shadow free effect.
  • 4M B/W Digital Camera, 15um X/Y‐resolution (20/25um configurable from factory).
  • 0.37um Z resolution.
  • SPC Plus software (Statistical Process Control).
  • Applicable PCB Size 50mmx50mm to 510mmx510mm.
  • No PCB color sensitivity.
  • Min. Paste deposit supported up to 3.94 mils.
  • Measurement Accuracy: < 1% on Calibration Target.
  • Measurement Accuracy: < 3% on PCB.
  • Measurement repeatability: < 10% on 01005 deposits @ 6 sigma [with 50% tolerance].
  • KSMART LINK Software - Closed loop feedback from AOI to SPI.

Pick and Place Machines

  • Fuji- AIMEX IIIc – 2 Robot x 2 Modules with a capacity of 1,03,000 CPH.
  • 48 x 48mm to 508mm x 400mm PCB handling capability.
  • PBGA, FBGA, Micro-BGA, CSP, Ultra-fine pitch QFP & QFN mounting capability.
  • Mounter accuracy of 0.025 mm, Cpk ≥ 1.00 (3σ).
  • Supports Fine pitch components (01005 & 0201)
  • Intelligent smart feeders (4mm to 72mm & 3 vibratory stick feeders).
  • Fuji- AIMEX IIIc with Tray unit for chip & IC/BGA/other components mounting.
  • Built‐in Auto Calibration and Hybrid calibration ensures placement accuracy to best level.
  • Image processing is through CCD camera.
  • FUJI Intelligent Feeders are of Variable pitch, electrically driven, Common for Paper & Emboss, Common for partsfrom 0402 mm (01005”) to 3225mm (1210”) parts size.
  • Three Extra feeder carts for quick change over.
  • Board level Traceability.
  • Free Feeder Allocation.

Pick and Place Machine

  • Panasonic NPM-D3A Pick and Place Machine with 92500 CPH.
  • Board handling capacity of 50mm × 50mm ~ 510mm × 590mm.
  • Mounter accuracy of 0.025 mm, Cpk ≥ 1.00 (3σ).
  • Supports Fine pitch components (01005 & 0201).
  • Intelligent smart feeders (4mm to 32mm).
  • Two Extra feeder carts for quick change over.
  • Built - in Auto Calibration and Hybrid calibration ensures placement accuracy to best level.
  • Image processing is through CCD camera.
  • Board level Traceability.
  • Free Feeder Allocation.

Reflow Oven

  • JTR-1000N Reflow Oven with Nitrogen Ready.
  • Heating zones 10 Top and Bottom.
  • Cooling Zones 3 Top and Bottom .
  • In-built Thermal Profiler.
  • Both Mesh & Chain Conveyors inbuilt.
  • Automatic Lubrication System (Including Automatic chain oilers).
  • Board Drop / Board Count Sensor with Animation.
  • Reflow Profiler KIC –X5 9 channel with Carrier available.
  • Camera Barcode Reader

3D Automated Optical Inspection(AOI)

  • Koh Young Inline 3D Automated Optical inspection (AOI)ZENITH ALPHAHS+.
  • 3D Inspection: Missing, Offset, Billboarding, Tombstone, Coplanarity, Solder Joint (insufficient, excessive), Lifted Leads, Bridging, "No‐Pops" Polarity.
  • 2D Inspection: "Wrong Part" using Optical Character Verification (OCV/R), Polarity.
  • Camera Barcode Reader.
  • 8M Pixel 3D Camera.
  • Maximum board handling capability of up to 490 x 510mm.
  • OCV & OCR capability.
  • 25mm 3D Height Inspection capability.
  • 5 Way 3D Projector Lighting System.
  • Auto Programming option & Offline programming software.
  • KSMART LINK Software - Closed loop feedback from AOI to SPI.